ANSI
INCITS
B10.3 Standing Document 1: Round Robin Test Data
Date
Last Updated:
This document is
an index to
the round robin test data obtained in the support of the development of
the
test methods described in in ANSI INCITS 322, Card Durability Test
Methods.
The essentials of
a round robin
test are:
1. Card samples
are supplied from the same production batch(es).
2. There may be
more than one type of card tested, but all testers test
the same card types.
3.
There are two or more testers
4. The testers
follow the detailed procedures of each test method.
These data are
being made
available to users of INCITS 322 as information on the significance of
test
value differences when comparing relative merits of cards under
evaluation.
|
Test
Method Number |
Description |
Round
Robin Testing Completed |
#
of labs in test |
Reference
(CDTF#s) |
Comments |
|
5.1 |
Delamination
- 180° |
Yes |
3 4 |
03-011 02-004 |
03-011
on flood blue card for consistency 02-004
on typical printed cards – had poor lab to lab consistency |
|
5.2 |
Delamination
- 90° |
Yes |
3 4 |
03-011 02-004 |
03-011
on flood blue card for consistency 02-004
on typical printed cards – had poor lab to lab consistency |
|
5.3 |
Delamination
– Cross Hatch Tape Test |
Yes |
3 |
99-020 |
|
|
5.4 |
ID-1
Card Flexure |
Yes |
6 |
99-006 |
|
|
5.5 |
ID-1
Card Static Stress |
Yes |
4 |
99-024 |
|
|
5.6 |
ID-1
Card Stress & Plasticizer Resistance |
Yes |
3 |
98-033 |
|
|
5.7 |
Impact
Resistance |
In-progress |
|
|
|
|
5.8 |
Elevated
Temperature & Humidity Exposure |
No |
|
|
1st
part of test sequence 6.1; Card Structure Integrity Test |
|
5.9 |
Surface
Abrasion |
No |
|
|
|
|
5.10 |
Bar
Code Abrasion (1D) |
Yes |
3 |
99-005 |
|
|
5.11 |
Magnetic
Stripe Abrasion |
Yes |
4 |
01-020 |
|
|
5.12 |
Image
Abrasion |
|
|
|
|
|
5.13 |
Temperature
& Humidity Induced Dye Migration |
Yes |
2 |
00-014 |
|
|
5.14 |
Plasticizer
Induced Dye Migration |
Yes |
2 |
00-015 |
|
|
5.15 |
Ultraviolet (UV)
Light Exposure |
No |
|
|
Currently
running tests.. Recording change in L, Cab, hab |
|
5.16 |
Daylight
Exposure Image Stability – Xenon Arc |
No |
|
|
|
|
5.17 |
Laundering
Test |
No |
|
|
|
|
Test
Method Number |
Description |
Round
Robin Testing Completed |
#
of labs in test |
Reference
(CDTF#s) |
Comments |
|
5.18 |
Embossed
Character Retention – Pressure |
Yes |
2 |
99-003 |
|
|
5.19 |
Embossed
Character Retention – Heat |
Yes |
3 |
99-003 |
|
|
5.20 |
Corner
Impact Test |
No |
|
|
2nd
part of test sequence 6.1; Card Structure Integrity Test |
|
5.21 |
Wet
Abrasion Test |
No |
|
|
3rd
part of test sequence 6.1; Card Structure Integrity Test |
|
5.22 |
IC
Card with Contacts Micro module Adhesion |
No |
|
|
|
|
5.23 |
Water
Soak Test |
No |
|
|
|
|
5.24 |
? |
|
|
|
|
|
5.25 |
Linear
Dimensional Change at Elevated Temperature |
No |
|
|
|
|
6.1 |
Card
Structure Integrity Test |
Yes |
|
99-038 99-030 |
Test
results were very descriptive. Expressed
difficulty in tabulating data. |
|
6.2 |
Card
Flexure and Delamination Sequence |
|
|
99-038 |
|
|
6.3 |
Elevated
Temperature/Humidity and Delamination Sequence |
|
|
99-038 |
|
|
6.4 |
Wet
Abrasion and Delamination Sequence |
|
|
|
|
|
6.5 |
Card
Flexure, Wet Abrasion and Delamination Sequence |
|
|
99-038 |
|
|
6.6 |
Ultraviolet
Light Exposure and Corner Impact Sequence |
|
|
01-004
00-024. 00-026 |
|